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Two
of greatest impediments in improving speed and bandwidth of connectivity
in Copper based interconnects is the skin loss at low frequencies
and dielectric loss in high frequencies. Our transmission line technologies significantly improve
the Signal Speed and Bandwidth
of interconnects
on any
material
used in the development of electronics
devices,
at the wafer, device, package, PCB, systems, and external cabling.
Our secret sauce is the way
we design and fab High Speed FLex Cables by using our fundamental patent pending technologies
including
PMTL™, Periodic Micro Transmission Lines,
for small formfactors
PMacTL™, Periodic
Macro Transmission Lines, for long formfactors
We have developed a family of High Speed Flex, of lengths from .5cm
to 1m, at single strands or cable bundles, jumpers, and High Speed
Serial Cabling. More often, as substitute for bulky coax and other
extruded wire cabling. We provide termination and connectors
to your PCB as RF Breakout from SMT arrays.
Our EM-Engineered High Speed Flex Bundles can provide 4X the
density of equivalent traditional Ganged Coax Connectors and Cable
bundles, and combination of SE and DP signaling. In fact, with
our PMacTL on Flex sheets, we can give you breakout from any 2D SMT
array on PCB to 3D fan-out RF coax interface you desire. We
can breakout any BGA foot print to RF-coax Connectors. For ATE Load
Boards, and DUT interface, we can provide reconfigurable Pogo Array
Break Out to another Pogo Array or VNA Port access for S-parameter
calibration and reference plane setting. Let us take a look at
your test connectivity challenges. We can help you meet your test
interface challenges. We want to be alternative to extruded coax.
Try us .
Below are some sample photos, measured S-parameter, TDR, and Eye
data for basic PMTL(tm)
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